Product profile
1.1 General description
This is a type of flexible circuit for the application of Intercom System. It's a multilayer
4 layer FPC at 0.25mm thick. The base laminate is using from ITEQ, It's fabricated per
IPC 6012 Class 2 using supplied Gerber data. Two types of stiffeners are applied on
the back side and top side.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. On-time service
L. Customer complaint rate: <1%
1.3 Application
General purpose LED soft light strip, Tablet PC capacitive screen soft board, Mobile
phone camera flex board
1.4 Parameter and data sheet
| Size of Flexible PCB | 71.25 X 80.38 |
| Number of Layers | 4 |
| Board Type | Flexible PCB |
| Board Thickness | 0.25mm |
| Board Material | Polyimide (PI) 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | 35 µm (1oz) |
| Surface Cu thickness | 35 µm (1oz) |
| |
| Coverlay Colour | Black |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | FR-4 / Stainless steel |
| Stiffener Thickness | 1.0mm / 0.2mm |
| |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
| |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
