Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Immersoin Gold PCB On 4 layer Copper with Blind Via and Green soldermask

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Shenzhen Bicheng Electronics Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissSally Mao
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Immersoin Gold PCB On 4 layer Copper with Blind Via and Green soldermask

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Brand Name :Bicheng Enterprise Limited
Model Number :BIC-0046-V4.6
Certification :UL
Place of Origin :China
MOQ :1
Price :USD 40 -50 per piece
Payment Terms :T/T, Paypal
Supply Ability :45000 pieces per month
Delivery Time :5-6 working days
Packaging Details :Vacuum
Glass Epoxy :FR-4, ITEQ IT-180 TG>170°C, er<5.4
Final height of PCB :1.6mm ±0.16
Final foil external :1 oz
Final foil internal :0.5 oz
Surface Finish :Immersion Gold (31.3%) 2 micoinch over 100 microinch nickel
Solder Mask Color :Green
Colour of Component Legend :White
Test :100% Electrical Test prior shipment
Number of Layers :4 Layers
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Product profile

1.1 General description


This is a type of 4 layer printed circuit board built on FR-4 substrate with Tg 170°C

for the application of Microcontroller. It's 1.6 mm thick with white silkscreen(Taiyo)

on green solder mask (Nanya) and immersion gold on pads. The base material is

from Taiwan ITEQ supplying 48 up PCB per panel. They're fabricated per IPC

6012 Class 2 using supplied Gerber data. Each 25 panels are packed for

shipment.

1.2 Features and benifits

A. Lead-Free Assembly Compatible
B. Long storage time (It can be stored for more than 1 year in vacuum bag)
C. Impedance control test and solder-ability test
D. Quick CADCAM checking and free PCB quotation
E. Quick Lead time: 3-5 days
F. Free stencil shim sent for new user


1.3 Application

GPRS, VHF Radio, Car Tracking Device, Communication Systems, Electric

Converter, Inverter Solar, PLC Ladder Logic, HSDPA USB Modem, 3G

Wireless Modem, Automobile


1.4 Parameter and data sheet

PCB SIZE 230 x 209mm=48PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.8um(0.5oz)+plate TOP layer
Prepreg 7628(43%) 0.195mm
copper ------- 18um(0.5oz) MidLayer 1
FR-4 1.0mm
copper ------- 18um(0.5oz) MidLayer 2
Prepreg 7628(43%) 0.195mm
copper ------- 17.8um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 6.7mil/5.9mil
Minimum / Maximum Holes: 0.3/2.5mm
Number of Different Holes: 13
Number of Drill Holes: 2512
Number of Milled Slots: 144
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL
Glass Epoxy: FR-4, ITEQ IT-180 TG>170°C, er<5.4
Final foil external: 1oz
Final foil internal: 0.5oz
Final height of PCB: 1.6mm ±0.16
PLATING AND COATING
Surface Finish

Immersion Gold (31.3%) 2 micoinch over

100 microinch nickel

Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, LP-4G G-05, Nanya supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:

Marked on the board in a conductor and

leged FREE AREA

VIA

Plated Through Hole(PTH), via tented.

Blind via from to inner layer 1

FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Immersoin Gold PCB On 4 layer Copper with Blind Via and Green soldermask

Automatic silkscreen machine

Immersoin Gold PCB On 4 layer Copper with Blind Via and Green soldermask

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