Product profile
1.1 General description
This is a type of flexible printed circuit for the application of Embedded System.
It’s a single layer FPC at 0.15mm thick. The base laminate is from ITEQ, It’s
fabricated per IPC 6012 Class 2 using supplied Gerber data. FR-4 as stiffner
is applied on the bottom side.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Diversified shipping method
L. Customer complaint rate: <1%
1.3 Application
Instrument panel, Mobile phone module flex board, Tablet PC camera soft board
1.4 Parameter and data sheet
| Size of Flexible PCB | 90.9 X 50.28mm |
| Number of Layers | 1 |
| Board Type | Flexible PCB |
| Board Thickness | 0.15mm |
| Board Material | Polyimide 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 µm |
| | |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | FR-4 |
| Stiffener Thickness | 1.0mm |
| | |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
| |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Film Exposure machine
