Product profile
1.1 General description
This is a type of Rigid flex PCB for the application of Micro USB. It’s a 4 layer
rigid-flex board at 1.0mm thick. The base laminate is from ITEQ, It’s fabricated
per IPC 6012 Class 2 using supplied Gerber data.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. No minimum order quantity and low cost sample.
L. Delivery on time. We keep higher than 98% on-time-delivery rate.
1.3 Application
Contact belt of inkjet printer, Industrial surveying and mapping instrument,
Tablet PC camera soft board,
1.4 Parameter and data sheet
| Size of Flexible PCB | 20.61 X 50.17mm |
| Number of Layers | 4 |
| Board Type | Rigid flex PCB |
| Board Thickness | 1.0mm |
| Board Material | 1.0mm FR-4 / Polyimide 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | 35 µm |
| Surface Cu thickness | 35 µm |
| | |
| Coverlay Colour | Yellow coverlay / Green solder mask |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | no |
| Stiffener Thickness | N/A |
| | |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
| |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
