Product profile
1.1 General description
This is a type of flexible printed circuit for the application of Power Electronics.
It’s a single layer FPC at 0.25mm thick with 2oz copper. The base laminate is
from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Focus on low to medium volume production
L. DDU Door to door shipment with competitive shipping cost.
1.3 Application
Telephone receiver/earphone FPC, Consumer game consoles, Tablet PC
capacitive screen soft board
1.4 Parameter and data sheet
| Size of Flexible PCB | 61.61 X 70.37mm |
| Number of Layers | 1 |
| Board Type | Flexible PCB |
| Board Thickness | 0.25mm |
| Board Material | Polymide 50µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| |
| PTH Cu thickness | N/A |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 70 µm (2 oz) |
| | |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | no |
| Stiffener Thickness | N/A |
| | |
| Type of Silkscreen Ink | N/A |
| Supplier of Silkscreen | N/A |
| Color of Silkscreen | N/A |
| Number of Silkscreen | N/A |
| |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
| |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
