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Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Home / Products / Hybrid PCB Board / Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module /

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Shenzhen Bicheng Electronics Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissSally Mao
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Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
Products Detailed
Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module (Flexible printed circuits are custom-made products, the ...
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melting bonding machine thermal bonding process metalized thermal lamination film

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