Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Shengyi S1000-2M Core and S1000-2MB Prepreg High Tg Printed Circuit Board (PCB) 0.05mm-3.2mm Thick 12um-105um Copper

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Shenzhen Bicheng Electronics Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissSally Mao
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Shengyi S1000-2M Core and S1000-2MB Prepreg High Tg Printed Circuit Board (PCB) 0.05mm-3.2mm Thick 12um-105um Copper

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Brand Name :Bicheng Technologies Limited
Model Number :BIC-504-V0.54
Certification :UL
Place of Origin :China
MOQ :1
Price :USD 2.99-9.99 PER PIECE
Payment Terms :T/T, Western Union
Supply Ability :45000 pieces per month
Delivery Time :10 working days
Packaging Details :Vacuum
Number of Layers :2
Glass Epoxy :S1000-2M
Final foil :3 Oz
Final height of PCB :1.6 mm ±10%
Surface Finish :HASL LF
Solder Mask Color :Blue
Colour of Component Legend :White
Test :100% Electrical Test prior shipment
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Shengyi S1000-2M Core and S1000-2MB Prepreg High Tg Printed Circuit Board (PCB) 0.05mm-3.2mm Thick 12um-105um Copper
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Features
Lead-free compatible FR-4 laminate
Tg170℃ (DSC), UV Blocking/AOI compatible
High heat resistance
Lower Z-axis CTE
Excellent through-hole reliability
Excellent Anti-CAF performance
Low water absorption
Excellent mechanical processability

Shengyi S1000-2M Core and S1000-2MB Prepreg High Tg Printed Circuit Board (PCB) 0.05mm-3.2mm Thick 12um-105um Copper


Applications
Computer
Communication
Automotive electronics
Suitable for high layer count PCB

Our PCB Capability (S1000-2M)

PCB Material:High Tg, High Performance and Low CTE Epoxy Resin
Designation:S1000-2M
Dielectric constant:4.6 at 10GHz
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness:0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology:HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.



General Properties of S1000-2M

Test ItemsTest MethodTest ConditionUnitTypical Value
TgIPC-TM-650 2.4.24.4DMA185
IPC-TM-650 2.4.25DDSC180
TdIPC-TM-650 2.4.24.6TGA (5% W.L)355
T260IPC-TM-650 2.4.24.1TMAmin>60
T288IPC-TM-650 2.4.24.1TMAmin30
T300IPC-TM-650 2.4.24.1TMAmin15
Thermal StressIPC-TM-650 2.4.13.1288, solder dips>100
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃41
IPC-TM-650 2.4.24After Tgppm/℃208
IPC-TM-650 2.4.2450-260℃%2.4
Permittivity (1GHz)IPC-TM-650 2.5.5.9C-24/23/50-4.6
Loss Tangent (1GHz)IPC-TM-650 2.5.5.9C-24/23/50-0.018
Volume ResistivityIPC-TM-650 2.5.17.1C-96/35/90MΩ-cm8.7×108
Surface ResistivityIPC-TM-650 2.5.17.1C-96/35/902.2×107
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-0.5/23s133
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-0.5/23kV>45
Peel Strength (1oz)IPC-TM-650 2.4.8288℃/10sN/mm [lb/in]1.3 [7.43]
Flexural Strength (LW/CW)IPC-TM-650 2.4.4AMpa567/442
Water AbsorptionIPC-TM-650 2.6.2.1D-24/23%0.08
FlammabilityUL94C-48/23/50RatingV-0
CTIIEC60112ARatingPLC 3


Shengyi S1000-2M Core and S1000-2MB Prepreg High Tg Printed Circuit Board (PCB) 0.05mm-3.2mm Thick 12um-105um Copper

























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