Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Rogers RO3203 Microwave PCB 2-Layer Rogers 3203 20mil Circuit Board DK3.02 DF 0.0016 High Frequency PCB

Rogers RO3203 Microwave PCB 2-Layer Rogers 3203 20mil Circuit Board DK3.02 DF 0.0016 High Frequency PCB

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Brand Name :Bicheng Technologies Limited
Model Number :BIC-122-V1.0
Certification :UL
Place of Origin :China
MOQ :1
Price :USD 9.99-99.99
Payment Terms :T/T, Western Union
Supply Ability :50000 pieces per month
Delivery Time :10 working days
Packaging Details :Vacuum
Number of Layers :2
Glass Epoxy :RO3203
Final foil :1.0 Oz
Final height of PCB :0.6 mm ±10%
Surface Finish :Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over 100 microinch nickel)
Solder Mask Color :no
Colour of Component Legend :White
Test :100% Electrical Test prior shipment
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Rogers RO3203 Microwave PCB Double Layer Rogers 3203 20mil Circuit Board DK3.02 DF 0.0016 High Frequency PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using
standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.

Rogers RO3203 Microwave PCB 2-Layer Rogers 3203 20mil Circuit Board DK3.02 DF 0.0016 High Frequency PCB

Features:
1. Woven glass reinforcement improves rigidity for easier handling.
2. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.
3. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.
4. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.
5. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs
and reliable surface mounted assemblies.
6. Excellent dimensional stability for high production yields.
7. Economically priced for volume manufacturing.
8. Surface smoothness allows for finer line etching tolerances

Typical Applications:
1. Automotive Collision Avoidance Systems
2. Automotive Global Positioning Satellite Antennas
3. Base Station Infrastructure
4. Datalink on Cable Systems
5. Direct Broadcast Satellites
6. LMDS and Wireless Broadband
7. Microstrip Patch Antennas
8. Power Backplanes
9. Remote Meter Readers
10. Wireless Telecommunications Systems

PCB Capability (RO3203)

PCB Material:Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation:RO3203
Dielectric constant:3.02±0.04
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..


Rogers RO3203 Microwave PCB 2-Layer Rogers 3203 20mil Circuit Board DK3.02 DF 0.0016 High Frequency PCB

Data Sheet of RO3203

PropertyRO3203DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.02±0.04Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ0.0016Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Conductivity0.47 (3.2) W/mKFloat 100℃ASTM C518
Volume Resistivity107 MΩ.cmAASTM D257
Surface Resistivity107 AASTM D257
Dimensional Stability0.08X, Ymm/m +E2/150after etchIPC-TM-650 2.4.3.9
Tensile Modulus X YkpsiRTASTM D638
Flexural Modulus400 300X YkpsiAASTM D790
Tensile Strength12.5 13X YkpsiRTASTM D638
Flexural Strength9 8X YkpsiAASTM D790
Moisure Absorption<0.1 %D24/23IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion58 13Z X,Yppm/℃-50 ℃to 288℃ASTM D3386
Td500 TGAASTM D3850
Density2.1 gm/cm323℃ASTM D792
Copper Peel Stength10 (1.74) lbs/in (N/mm)After solderIPC-TM-650 2.4.8
FlammabilityV-0 UL 94
Lead-Free Process CompatibleYes

Rogers RO3203 Microwave PCB 2-Layer Rogers 3203 20mil Circuit Board DK3.02 DF 0.0016 High Frequency PCB


































China Rogers RO3203 Microwave PCB 2-Layer Rogers 3203 20mil Circuit Board DK3.02 DF 0.0016 High Frequency PCB for sale

Rogers RO3203 Microwave PCB 2-Layer Rogers 3203 20mil Circuit Board DK3.02 DF 0.0016 High Frequency PCB

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