Rogers HF PCB Built on RT/Duroid 6002 60mil 1.524mm DK2.94 with Immersion Gold for Commercial Airline Collision Avoidance
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RT/duroid 6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.
The thermal coefficient of dielectric constant is extremely low from -55℃ to +150℃ which provides the designers of filters, oscillators and delay lines the electrical stability needed in today's demanding applications.
A low Z axis coefficient of thermal expansion(CTE) ensures excellent reliability of plated through holes. RT/duroid 6002 materials have been successfully temperature cycled (-55℃ TO 125℃) for over 5000 cycles without a single via failure.
Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficient of expansion to copper. This often eliminates double etching to achieve tight positional tolerances.
The low tensile modulus (X,Y) greatly reduces the stress applied to solder joints and allows the expansion of the laminate to be constrained by a minimum amount of low CTE metal (6 ppm/℃) further increasing surface mount reliability.
Applications particularly suited to the unique properties of RT/duroid 6002 material include flat and non-planar structures such antennas, complex mutli-layer circuits with inter-layer connections, and microwave circuits for aerospace designs in hostile environments.
Typical applications:
1. Airborne radar systems
2. Beam forming networks
3. Commercial airline collision avoidance
4. Global positioning systems antennas
5. Ground base systems
6. High reliability complex multi-layer circuits
7. Phased array antennas
8. Power backplanes
PCB Specifications
| PCB SIZE | 99 x 99 mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RT/duroid 1.524mm |
| copper ------- 18um(0.5 oz)+plate BOT layer |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.3 mm / 2.0mm |
| Number of Different Holes: | 1 |
| Number of Drill Holes: | 3 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RT/duroid 1.524mm |
| Final foil external: | 1 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 1.6 mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (51.3% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | NO |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | NO |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 6002 (RT/duroid 6002)
| RT/duroid 6002 Typical Value |
| Property | RT/duroid 6002 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.94±0.04 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Dielectric Constant,εDesign | 2.94 | | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0012 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +12 | Z | ppm/℃ | 10 GHz 0℃-100℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 106 | Z | Mohm.cm | A | ASTM D 257 |
| Surface Resistivity | 107 | Z | Mohm | A | ASTM D 257 |
| Tensile Modulus | 828(120) | X,Y | MPa(kpsi) | 23℃ | ASTM D 638 |
| Ultimate Stress | 6.9(1.0) | X,Y | MPa(kpsi) |
| Ultimate Strain | 7.3 | X,Y | % |
| Compressive Modulus | 2482(360) | Z | MPa(kpsi) | | ASTM D 638 |
| Moisture Absorption | 0.02 | | % | D48/50 | IPC-TM-650 2.6.2.1
ASTM D 570 |
| Thermal Conductivity | 0.6 | | W/m/k | 80℃ | ASTM C518 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 16
16
24 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | | ℃ TGA | | ASTM D 3850 |
| Density | 2.1 | | gm/cm3 | | ASTM D 792 |
| Specific Heat | 0.93(0.22) | | j/g/k
(BTU/ib/OF) | | Calculated |
| Copper Peel | 8.9(1.6) | | Ibs/in.(N/mm) | | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
