5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hi Everyone,
Today, we're going to talk about a type of 5-layer high frequency PCB made on Rogers RO4003C.
5 layer PCB is fabricated on 3 cores of RO4003C and etched 1 layer copper off to achieve 5 layers.
Viewing from the stack up, we can see 3 sheets of 20 mil cores achieve the basic layer structure, 2 layers of dielectric material (prepreg) bond the 3 cores which result in 5-layer board. Copper weight in inner-layer is half ounce, outer-layer 1 ounce. Final height of the board is 2.1mm thick.
Following is the picture of micro-section, which can more intuitively reflect the structure of the board. No solder mask is applied on the surface, pads are immersion gold plated.
Actually the stack up of multilayer PCBs can be done in many different ways according to the different requirements or applications for controlled impedances, signal transmission etc. There’re many types of cores for our designer to choose in RO4003C family, such as 8mil, 12mil, 16mil, 20mil, 32mil and 60mil etc.
The core has fixed thickness, it is very important to the electrical length of RF lines on the circuit board.
We have a variety of high frequency materials for customers to choose from, the main are Rogers 4000 series, 3000 series, 5000 series and 6000 series, Taconic TLX series, TLY series etc. and Chinese F4B series etc.
If you're interested in, please feel free to contact us.
Thank you for your reading.
Our PCB Capability 2022
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
