Mastering Precision SMT Assembly with High-Quality Stencils
An SMT stencil is one of the most important tools for ensuring accurate, consistent solder paste deposition in surface mount assembly lines. Here at Bicheng, we craft the finest stencils using a combination of advanced technologies and strict quality controls.
Laser Cutting Precision
Our stencils are fabricated from medical-grade stainless steel foil using ultrafast laser micro-machining. This non-contact process shapes each aperture with micron-level precision directly from customer-supplied Gerber data. Finely tunable laser power and speed allow foils as thin as 0.05mm to be cut without fracturing or deformations.
Foil thicknesses from 0.05mm to 0.4mm can be easily handled to match the needs of any component size or packaging mix. Thinner foils enable higher-density 0201 and 01005 pad apertures while thicker versions withstand more reflow cycles.
Frame Types for Any Application
In addition to frameless stencils, we offer rigid aluminum frame options measuring 370x470mm up to 736x736mm. Larger formats service boards up to 30x40cm while compact frames are suited for benchtop or R&D assemblers with space constraints. Durable frames protect foils during wiping, shipping and handling.
Shrinkage for Paste Release
All apertures feature controlled shrinkage dimensions based on IPC recommendations. For example, 0201 pad apertures are shrunk 5-10% to ensure paste readily deposits during wiping. This "spring tension" effect prevents bridging and voids caused by paste overfilling.
Reliability through Quality
Our ISO9001 certified production facilities maintain stringent process controls. Each stencil receives in-process inspections for dimensional accuracy, registration and cleanliness before shipping. Contact us today to discuss how our high-quality stencils can elevate the performance and output of your SMT lines.
