Introducing Our New High-Performance Rogers RO4533 PCB
We are excited to announce the launch of our new low-loss, high-frequency PCB made with Rogers Corporation's RO4533 laminates. This material is specifically engineered to provide excellent electrical performance for demanding RF applications.
The Roger RO4533 laminates have a dielectric constant of just 3.3 at 10GHz. This low dielectric constant enables tighter control over impedance as frequencies increase into the GHz range. Equally important, the dissipation factor is an extremely low 0.0025 at 10GHz. This means less signal loss and attenuation as waves propagate through the PCB substrate.
We use a 2-layer construction with 1 ounce copper on both the top and bottom layers. The thicker 1oz copper provides lower loss compared to standard 1/2 or 1/4 ounce copper foil. It also allows for higher current carrying capacity - a must for many RF circuits.
| Specification |
Value |
| Board dimensions |
185.78mm x 139.87 mm |
| Quantity |
1 PCS |
| Tolerance |
+/- 0.15mm |
| Minimum Trace/Space |
5/6 mils |
| Minimum Hole Size |
0.4mm |
| Blind vias |
No |
| Finished board thickness |
0.6mm |
| Finished Cu weight |
1oz (1.4 mils) outer layers |
| Via plating thickness |
20 μm |
| Surface finish |
Immersion Gold |
| Top Silkscreen |
White |
| Bottom Silkscreen |
No |
| Top Solder Mask |
Green |
| Bottom Solder Mask |
No |
In between the copper layers, a 0.508mm thick core of Rogers RO4533 material provides consistent dielectric properties throughout the board. The dielectric constant stays uniform across the x, y, and z directions. This consistency helps maintain precise impedance control and signal integrity for your controlled-impedance traces.
Other key construction specifications include:
- Board dimensions of 185.78mm x 139.87mm for consistency
- 5/6 mil minimum trace/space for high-density designs
- 0.4mm minimum hole diameter for ease of assembly
- Immersion gold finish for oxidation resistance
- IPC Class 2 fabrication for high-reliability and quality
The RO4533 material uses a thermoset resin system that is engineered for compatibility with standard PCB fabrication methods. It allows for excellent dimensional stability during etching, plating, and lamination while minimizing shrinkage or warpage. The result is higher yields and consistent performance when producing large PCB panels.
Features and Benefits:
- Low Loss, Low Dk and low PIM response for wide range of application use
- Thermoset resin system compatible with standard PCB fabrication
- Excellent dimensional stability for greater yield on larger panels sizes
- Uniform mechanical properties for maintaining mechanical form during handling
- High thermal conductivity for improved power handling
Let us know if you have any other questions! We're happy to provide more detail about the electrical or mechanical performance factors that make our Rogers RO4533 PCBs ideal for cellular, WiMAX, microwave and other high-frequency applications. Just contact Sally Mao at sales30@bichengpcb.com.
