Our Highest Performing PCB Material Yet - Introducing Wangling F4BM250
We're thrilled to introduce a new addition to our PCB substrate portfolio - Wangling F4BM250. This low-loss PTFE fiberglass material opens up new possibilities for designers tackling the most stringent RF/microwave applications.
Unmatched Electrical Performance
With a dielectric constant of just 2.5 and an astonishingly low loss tangent of 0.0012 at 10GHz, F4BM250 sets the standard for maximizing signal integrity at high frequencies. Its properties allow for faster data rates, tighter circuit packaging and reduced component heating compared to traditional substrates.
Robust and Reliable
The material absorbs miniscule amounts of moisture (<0.08%) and maintains highly stable dimensions across operating temperatures, due to its carefully engineered thermal expansion coefficients. This ensures consistently excellent performance in all ambient conditions.
Broad Manufacturing Flexibility
F4BM250 is commercially produced at mass scale, giving us flexibility to offer boards in a wide range of dimensions and thicknesses from 0.2mm to multiple millimeters. Its compatibility with standard fabrication also allows value-added options like plated through-holes.
Ideal for Demanding Applications
From phased arrays and satellite transmitters to base stations and radar systems, F4BM250 is the right choice when bandwidth, power efficiency and operational reliability are mission-critical. Its properties even push the boundaries of potential for emerging technologies like 5G.
Prototype Your Design Today
Work with our engineers to evaluate standard 2-layer or custom multi-layer configurations using F4BM250. With assembly and test capabilities in-house, we can help accelerate your development schedule.
Get Started Below
Please contact us to discuss incorporating this game-changing substrate into your next high-frequency design. One of our representatives will also be happy to address any technical questions.
