Rogers RO4725JXR Antenna Grade High Frequency Printed Circuit Board DK 2.55 RF PCB 30.7mil 60.7mil
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RO4725JXR antenna grade laminates offer a dependable and cost-effective substitute for traditional PTFE-based laminates.
The resin systems used in RO4725JXR dielectric materials offer the essential properties required for optimal antenna performance. RO4725JXR antenna grade laminates are fully compatible with conventional FR-4 and high-temperature lead-free solder processes. Unlike traditional PTFE-based laminates, these materials do not require special treatment for plated through-hole preparation. By choosing RO4725JXR laminates, designers can achieve cost-effective solutions without compromising performance.
Features:
1.Dielectric constant of 2.55+/- 0.05
2. Low Z-axis coefficient of thermal expansion at 25.6 ppm/°C
3. Low TCDk (Thermal Coefficient of Dielectric Constant) of +34 ppm/°C
4. Dissipation factors ranging from .0022 to .0026
5. High glass transition temperature (Tg) exceeding 280°C
Benefits:
- Low insertion loss, ensuring minimal signal loss during transmission
- Dk (Dielectric Constant) matched to standard PTFE-based antenna offerings, facilitating seamless integration with existing designs
- Reduced passive inter-modulation (PIM), leading to improved signal quality and less interference
- Consistent circuit performance, providing reliable and predictable results.
Our PCB Capability( RO4725JXR)
| PCB Capability (TMM10) | |
| PCB material: | Hydrocarbon / Ceramic / Woven Glass |
| Designation: | RO4725JXR |
| Dielectric constant: | 2.55 |
| Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| Dielectric thickness: | 30.7mil(0.780mm), 60.7mil (1.542mm) |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Red, Yellow, White etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc.. |
Typical Applications
Cellular Base Station Antennas
RO4725JXR Typical Properties
| Property | RO4725JXR | Direction | Units | Condition | Test Method |
| Dielectric Constant, εr Process | 2.55 ± 0.05 | Z | | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 |
| Dielectric Constant, εr Design | 2.64 | Z | | 1.7 GHz - 5
GHz | Differential Phase Length Method |
| Dissipation Factor | 0.0026 | Z | | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 |
| 0.0022 | | 2.5GHz |
| Thermal Coefficient of εr | +34 | Z | ppm/°C | -50°C to 150°C | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity (0.030") | 2.16 X 10^8 | | MΩ•cm | COND A | IPC-TM-650, 2.5.17.1 |
| Surface Resistivity (0.030") | 4.8 X 10^7 | | MΩ | COND A | IPC-TM-650, 2.5.17.1 |
| PIM | -166 | | dBc | 50 ohm
0.060” | 43dBm
1900MHz |
| Electrical Strength (0.030”) | 630 | Z | V/mil | | IPC-TM-650, 2.5.6.2 |
| Flexural Strength MD | 121 (17.5) | | MPa
(kpsi) | RT | ASTM D790 |
| CMD | 92 (13.3) | |
| Dimensional Stability | <0.4 | X,Y | mm/m | after etch
+E2/150°C | IPC-TM-650, 2.4.39A |
Coefficient of Thermal
Expansion | 13.9 | X | ppm/°C | -55 TO 288°C | IPC-TM-650, 2.1.24 |
| 19.0 | Y |
| 25.6 | Z |
| Thermal Conductivity | 0.38 | Z | W/mK° | 50°C | ASTM D5470 |
| Moisture Absorption | 0.24% | | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Tg | >280 | | °C | | IPC-TM-650 2.4.24 |
| Td | 439 | | °C | | ASTM D3850 |
| Density | 1.27 | | gm/cm3 | | ASTM D792 |
| Copper Peel Strength | 8.5 | | pli | 1 oz LoPro EDC | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL94 |
| Lead-Free Process Compatible | YES | | | | |
