Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Introducing TLX-8: A High-Performance PCB Material for Advanced Electronics

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Shenzhen Bicheng Electronics Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissSally Mao
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Introducing TLX-8: A High-Performance PCB Material for Advanced Electronics

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Brand Name :Bicheng Enterprise Limited
Model Number :BIC-0303-V3.03
Certification :UL
Place of Origin :CHINA
MOQ :1 PIECE
Price :USD2 .99-7.99 per piece
Payment Terms :T/T,Paypal
Supply Ability :50000 PIECE PER MONTH
Delivery Time :8-9 WORKING DAY
Packaging Details :VACUUM
Board Material :Polyimide 12.5μm + 0.2mm polyimide stiffener
Board Thickness :0.15 mm
Surface/Inner layer Cu thickness :35 µm
Surface Finish :Immersion Gold
Coverlay Colour :Yellow
Color of Silkscreen :White
Function :100% Pass electrical test
Number of Layers :2
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Introduction:
Welcome to the next generation of high-performance PCB materials. We proudly present TLX-8, a game-changing solution designed to revolutionize the world of advanced electronics. With its outstanding properties and unwavering reliability, TLX-8 sets new standards in the industry, empowering cutting-edge electronic applications.

Unraveling Unparalleled Dielectric Prowess:
TLX-8 emerges as the undisputed champion of dielectric materials, offering an unparalleled DK (dielectric constant) of 2.55 at 10 GHz. This remarkable attribute ensures swift and efficient signal transmission. Equally impressive is its meager Df (dissipation factor) of 0.0012 at 1.9 GHz and 0.0017 at 10 GHz, minimizing signal loss and elevating electrical performance to unprecedented heights.

Unyielding Mechanical Fortitude:
Prepare to be amazed by the resolute strength of TLX-8. Flexural strength becomes its superpower, flexing its muscle at a staggering 28,900 psi (approximately 199.6 MPa) in the machine direction (MD) and 20,600 psi (approximately 142.1 MPa) in the cross-direction (CD). Brace yourself for the tensile strength of 35,600 psi (approximately 245.3 MPa) in the MD and 27,500 psi (approximately 189.6 MPa) in the CD.

Uncompromising Resilience:
TLX-8 revels in its ability to withstand and endure. Exhibiting an elongation at break of 3.94% in both the MD and CD directions, it refuses to yield under pressure. Encapsulating this tenacity is its Young's Modulus, a remarkable 980 kpsi (approximately 6,758 MPa) in the MD and 1,200 kpsi (approximately 8,274 MPa) in the CD, truly epitomizing stability and unyielding strength.

Thermal and Electrical Brilliance:
Behold TLX-8's thermal mastery, as it dissipates heat with unparalleled finesse. With a thermal conductivity of just 0.19 W/M*K, it ensures optimal thermal management, a vital consideration in high-power applications. Witness TLX-8's unwavering dimensional stability, barely flinching under varying thermal stress conditions, with minimal fluctuations in mils/inch (mm/M) in both the MD and CD.

Reliability and Safety Uncompromised:
TLX-8 stands tall in the realm of reliability, boasting a dielectric breakdown strength surpassing 45 kV. This impenetrable barrier protects against electrical breakdown, fortifying the longevity of electronic devices. Furthermore, with a moisture absorption rate of a mere 0.02%, TLX-8 remains impervious to environmental conditions that could compromise performance.

Igniting Innovation, Ensuring Safety:
TLX-8's UL-94 flammability rating of V-0 underscores its commitment to unwavering safety standards. With a density of 2.25 g/cm3, it offers a lightweight solution without compromising on performance, igniting innovation while keeping environmental considerations at the forefront.

Conclusion:
TLX-8 represents a paradigm shift in PCB materials, ushering in a new era of excellence in advanced electronics. Its unmatched dielectric properties, unwavering mechanical strength, exceptional thermal conductivity, and steadfast reliability make it the material of choice for those seeking superior performance and durability. With TLX-8, engineers and designers can push the boundaries of what's possible, forging a future where unimaginable possibilities become reality.

Property Test Method Unit TLX-8 Value Unit Value
DK @10 GHz IPC-650 2.5.5.3 2.55 2.55
Df @1.9 GHz IPC-650 2.5.5.5.1 0.0012 0.0012
Df @10 GHz IPC-650 2.5.5.5.1 0.0017 0.0017
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Flexural Strength(MD) ASTM D 709 psi 28,900 N/mm2
Flexural Strength(CD) ASTM D 709 psi 20,600 N/mm2
Tensile Strength(MD) ASTM D 902 psi 35,600 N/mm2
Tensile Strength(CD) ASTM D 902 psi 27,500 N/mm2
Elongation at Break(MD) ASTM D 902 % 3.94 % 3.94
Elongation at Break(CD) ASTM D 902 % 3.92 % 3.92
Young's Modulus(MD) ASTM D 902 kpsi 980 N/mm2
Young's Modulus(CD) ASTM D 902 kpsi 1,200 N/mm2
Young's Modulus(MD) ASTM D 3039 kpsi 1,630 N/mm2
Poisson's Ratio ASTM D 3039 0.135 N/mm
Peel Stength(1 oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 15 N/mm
Peel Stength(1 oz.RTF) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 17 N/mm
Peel Stength(½ oz.ed) IPC-650 2.4.8.3(Elevated Temp.) Ibs./linear inch 14 N/mm
Peel Stength(½ oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 11 N/mm
Peel Stength(1 oz.rolled) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 13 N/mm 2.1
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(After Bake.) mils/in. 0.06 mm/M
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.4(After Bake.) mils/in. 0.08 mm/M
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.09 mm/M
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.1 mm/M
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm 6.605 x 108 Mohm 6.605 x 108
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm 3.550 x 106 Mohm 3.550 x 106
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm/cm 1.110 x 1010 Mohm/cm 1.110 x 1010
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm/cm 1.046 x 1010 Mohm/cm 1.046 x 1010
Thermal Conductivity ASTM F433/ASTM 1530-06 W/M*K 0.19 W/M*K 0.19
CTE(X axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 21 ppm/℃ 21
CTE(Y axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 23 ppm/℃ 23
CTE(Z axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 215 ppm/℃ 215
Density(Specific Gravity) ASTM D 792 g/cm3 2.25 g/cm3 2.25
Td(2% Weight Loss) IPC-650 2.4.24.6(TGA) 535
Td(5% Weight Loss) IPC-650 2.4.24.6(TGA) 553
Flammability Rating UL-94 V-0 V-0
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