Shenzhen Bicheng Electronics Technology Co., Ltd
RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,
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General Profile
Metal core PCB is thermal management circuit board used in LED lighting which
needs fast cooling dissipation. The metal core can be aluminum (aluminum core
PCB) and copper (copper core PCB), even iron base. The fastest speed of heat
transfer is on copper which is designed in the form of thermoelectric separation.
Advantages
1) Effective heat dissipation reduces the operating temperature of the module
and prolongs the service life;
2) Power density and reliability are improved up 10%;
3) Reduce the dependence of heat sinks and other hardware (including thermal
interface materials);
4) Reduce the volume of the product;
5) Reduce the cost of hardware and assembly;
6) Optimization combination of power circuit and control circuit;
7) Replace the fragile ceramic substrate and obtain a better mechanical durability;
8) Reduce the operating temperature of the equipment;
Applications
Metal Core PCB Capability
| NO. | Parameter | Value |
| 1 | Type of Metal Core | Aluminum, Copper, Iron |
| 2 | Model of Metal Core | A1100, A5052, A6061, A6063, C1100 |
| 3 | Surface Finish | HASL, Immersion Gold, Immersion Silver, OSP |
| 4 | Thickness of Surface plating | HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm |
| 5 | Layer Count | 1-4 Layers |
| 6 | Maximum of Board Size | 23" x 46" (584mm×1168mm) |
| 7 | Mininum of Board Size | 0.1969" x 0.1969" (5mm×5mm) |
| 8 | Board Thickness | 0.0157" x 0.2362" (0.4-6.0mm) |
| 9 | Copper Thickness | 0.5OZ(17.5µm),1OZ(35µm), 2OZ(70µm),3OZ(105µm), 4OZ(140µm) to 10oz (350µm) |
| 10 | Minimum Track Width | 5mil (0.127mm) |
| 11 | Minimum Space | 5mil (0.127mm) |
| 12 | Minimum Hole Size | 0.0197" (0.5mm) |
| 13 | Maximum Hole Size | No limit |
| 14 | Minimum Holes Punched | PCB thickness <1.0mm: 0.0394" (1.0mm) |
| PCB thikness 1.2-3.0mm: 0.0591" (1.5mm) | ||
| 15 | PTH Wall Thickness | >20µm |
| 16 | Tolerance of PTH | ±0.00295" (0.075mm) |
| 17 | Tolerance of NPTH | ±0.00197" (0.05mm) |
| 18 | Deviation of Hole Position | ±0.00394" (0.10mm) |
| 19 | Outline Tolerance | Routing: ±0.00394" (0.1mm) |
| Punching: ±0.00591" (0.15mm) | ||
| 20 | Angle of V-cut | 30°, 45°, 60° |
| 21 | V-cut Size | 0.1969" x 47.24" (5mm×1200mm) |
| 22 | Thickness of V-cut Board | 0.0236" x 0.1181" (0.6-3mm) |
| 23 | Tolerance of V-cut Angle | ±5º |
| 24 | V-CUT Verticality | ≤0.0059" (0.15mm) |
| 25 | Minimum Square Slots Punched | PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm) |
| PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm) | ||
| 26 | Minimum BGA PAD | 0.01378" (0.35mm) |
| 27 | Minimum Width of Solder Mask Bridge. | 8mil (0.2032mm) |
| 28 | Minimum Thickness of Solder Mask | >13µm (0.013mm) |
| 29 | Insulation Resistance | 1012ΩNormal |
| 30 | Peel-off Strength | 2.2N/mm |
| 31 | Solder float | 260℃ 3min |
| 32 | E-test Voltage | 50-250V |
| 33 | Thermal Conductivity | 0.8-8W/M.K |
| 34 | Warp or Twist | ≤0.5% |
| 35 | Flammability | FV-0 |
| 36 | Minimum Height of Component indicator | 0.0059"(0.15mm) |
| 37 | Minimum Open Solder Mask on Pad | 0.000394" (0.01mm) |
The Variety of PCBs
