Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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RO4003C Multilayer PCB 4-Layer 4.8mm Thick design for RF microwave circuits and matching networks and controlled impedance transmission lines

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Shenzhen Bicheng Electronics Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissSally Mao
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RO4003C Multilayer PCB 4-Layer 4.8mm Thick design for RF microwave circuits and matching networks and controlled impedance transmission lines

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Bridging the Gap Between Electrical Performance and Manufacturability
Designing high-frequency circuits requires a delicate balance between electrical properties and fabrication considerations. Traditionally, circuit board materials have often forced engineers to compromise on one aspect or the other. However, the RO4003C laminates represent a breakthrough in this regard, seamlessly blending the superior electrical performance of PTFE/woven glass with the ease of manufacturability associated with epoxy/glass laminates.

Unparalleled Electrical Characteristics
At the heart of the RO4003C lies a dielectric constant (Dk) of 3.38 ± 0.05, measured at 10 GHz, and a remarkably low dissipation factor (Df) of 0.0027, also at 10 GHz. These stable and consistent electrical properties make the RO4003C an exceptional choice for a wide range of high-frequency applications, from microwave circuits and matching networks to controlled impedance transmission lines.

Thermal Management Mastery
Thermal management is a critical consideration in high-frequency designs, and the RO4003C delivers exceptional performance in this regard. With a thermal conductivity of 0.71 W/m/°K and a low thermal coefficient of dielectric constant (+40 ppm/°C), these laminates ensure reliable operation even in the most demanding operating environments, mitigating the risk of thermal-related failures.

Dimensional Stability Redefined
Dimensional stability is paramount for high-frequency circuit fabrication, and the RO4003C excels in this area. Its coefficient of thermal expansion (CTE) is closely matched to copper, with an X-axis of 11 ppm/°C and a Y-axis of 14 ppm/°C, ensuring a seamless integration with copper traces and minimizing the risk of deformation or failure during the manufacturing process.

Versatility and Cost-Effectiveness
The RO4003C materials are available in various configurations, utilizing both 1080 and 1674 glass fabric styles, all meeting the same exceptional electrical performance specification. This versatility, combined with their non-brominated and non-UL 94 V-0 rated composition, makes the RO4003C an economically viable choice for a wide range of high-frequency applications.

Empowering Innovation Across Diverse Industries
The RO4003C laminates have found their way into a diverse array of high-frequency applications, from commercial airline broadband antennas and millimeter-wave systems to radar guidance applications and point-to-point digital radio antennas. Wherever the need for high-performance, stable, and cost-effective circuit materials arises, the RO4003C is poised to deliver exceptional results.

A Trusted Partner in High-Frequency Success
At Rogers Corporation, we take pride in our commitment to innovation and customer success. As a senior sales manager, I've seen firsthand how the RO4003C has transformed the design possibilities for our customers, enabling them to push the boundaries of what's achievable in high-frequency electronics.

If you're looking to elevate your high-frequency design to new heights, I invite you to discover the power of the Rogers RO4003C High Frequency Circuit Materials. Contact our sales team today to learn more about how these advanced laminates can unlock your design potential and drive your business forward.

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