Rogers RO4003C/RO4450F Mixed Pressure 3-Layer PCB, 1.82mm Thickness Substrates with Black Solder Mask, and Immersion Gold Finish

3-Layer PCB with Rogers RO4003C/RO4450F, 1.82mm Thickness, Black Solder Mask, and Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Hi, I’m excited to share details about one of our premium products: the 3-layer PCB with Rogers RO4003C and RO4450F materials. This PCB is designed for performance-sensitive RF and microwave applications, offering high thermal stability, low signal loss, and excellent dimensional stability. With a 1.82mm thickness, black solder mask, and white silkscreen, this PCB is perfect for cellular base stations, automotive radar, and broadcast satellites.

1. Overview of the 3-Layer PCB

This 3-layer rigid PCB uses a combination of Rogers RO4003C for the core and RO4450F bonding ply, offering the high-frequency performance of PTFE materials with the easy manufacturability of FR-4. The board has been designed with blind vias connecting the top layer to the inner layer to ensure efficient interconnectivity without sacrificing signal integrity.

The black solder mask on the top layer enhances its durability, while the immersion gold surface finish ensures excellent solderability and corrosion resistance. The white silkscreen provides clarity for component placement, making assembly easier and more accurate. Every PCB undergoes 100% electrical testing and is manufactured to IPC-Class-2 standards, ensuring high quality and reliability.

2. PCB Construction Details

3. PCB Stackup

The 3-layer stackup is optimized for high-frequency applications, balancing performance and reliability. Here’s how the layers are structured:

4. Features of Rogers RO4003C

• Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz, ensuring stable signal transmission.
• Dissipation Factor (Df):
  • 0.0027 at 10 GHz.
  • 0.0021 at 2.5 GHz, ensuring minimal signal loss.
• Thermal Stability:
  • Tg > 280°C.
  • Thermal Conductivity: 0.71 W/mK, ensuring efficient heat dissipation.
• Dimensional Stability:
  • Low CTE: X-axis: 11 ppm/°C, Y-axis: 14 ppm/°C, Z-axis: 46 ppm/°C.
• Moisture Resistance: 0.06% absorption, ensuring reliability in humid environments.

5. Benefits of Rogers RO4003C/RO4450F

Cost-Effective Manufacturing: Processes like FR-4 materials, reducing overall fabrication costs.

Multi-Layer Compatibility: Ideal for complex multi-layer PCB constructions with mixed dielectrics.

Reliable Performance: Excellent dimensional stability and thermal reliability, even under thermal shock or high-frequency conditions.

High-Volume Feasibility: Competitively priced for large-scale manufacturing without compromising on quality.

6. Applications of the 3-Layer PCB

Cellular Base Station Antennas and Power Amplifiers

RF Identification Tags

Automotive Radar and Sensors

Direct Broadcast Satellites (LNB)

Datalink on Cable Systems

Why Choose Bicheng Technologies?

At Bicheng Technologies Limited, we specialize in manufacturing high-quality PCBs tailored to meet the unique needs of our clients. Our 3-layer PCB with Rogers RO4003C/RO4450F is an excellent example of our commitment to delivering reliable, high-performance PCBs for complex applications.

What Sets Us Apart:

1. Global Reach: We deliver worldwide, ensuring timely support for your projects.
2. Quality Assurance: All PCBs are manufactured to IPC-Class-2 standards and undergo rigorous testing.
3. Customer-Centric Approach: We prioritize your needs and provide customized solutions.

If you’d like to learn more or have specific questions, feel free to contact me at sales30@bichengpcb.com. Let’s bring your innovative ideas to life with our expertise in advanced PCB manufacturing.