Shenzhen Bicheng Electronics Technology Co., Ltd
RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,
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TC350 High Frequency PCB
Introduction
Rogers TC350 laminates are composite substrates of PTFE, highly thermally conductive ceramic fillers and woven glass reinforcement, offering outstanding thermal conductivity to enhance heat transfer, thereby reducing dielectric and insertion loss, which results in higher gains and efficiencies in amplifiers and antennas. Its increased thermal conductivity handles higher power, reduces hot-spots, and boosts device reliability.
TC350 laminates are effective in designs with limited thermal management, improving heat transfer through the laminate, lowering junction temperatures, and extending the lifespan of active components. Its lower operating temperatures and matching thermal expansion characteristics with chips enhance component attachment reliability, reducing issues like solder fatigue and joint failure.
Features and Benefits
The TC350 laminate has a Dk of 3.5, ensuring precise impedance control and efficient signal transmission in high-frequency applications.
It exhibits excellent thermal conductivity of 0.72W/m-K, allowing for effective heat dissipation through the laminates.
TC350 maintains low thermal coefficient of Dk at -9 ppm/°C (-40°C to 140°C) minimizing the impact of temperature changes on the PCB, ensuring reliable signal transmission.
It features a low loss tangent of 0.002 at 10GHz, resulting in minimal signal loss. This feature improves bandwidth utilization and increases the efficiency of amplifiers and antennas operating at high frequencies.
TC350 exhibits low coefficients of thermal expansion on X, Y, and Z axes (7, 7, and 23 ppm/°C, respectively), providing reliable plated through hole connections and excellent dimensional stability.
PCB Capability
| PCB Material: | Woven Fiberglass Reinforced, Ceramic Filled, PTFE Composite |
| Designation: | TC350 |
| Dielectric constant: | 3.5±0.05 |
| Thermal Conductivity | 0.72 W/m-K |
| Dissipation Factor | Df .002@10 GHz |
| Layer count: | Single Layer, Double Layer, Multi-layer, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc.. |
Our PCB manufacturing capability allows for the production of single -sided, double-sided, multi-layer boards, and hybrid PCBs.
You can choose from copper weight options of 1oz (35µm) and 2oz (70µm).
We accommodate various PCB thicknesses, including 10mil, 20mil, 25mil, 60mil, and 125mil, and the maximum PCB size we can manufacture is 400mm X 500mm.
We offer multiple solder mask options such as green, black, blue, yellow, and red, as well as different surface finish options including bare copper, HASL, ENIG, OSP, immersion silver, immersion tin, ENEPIG, pure gold and so on.
Applications
TC350 finds widespread applications in power amplifiers, filters, couplers, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), microwave combiner and power dividers etc.
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