Shenzhen Bicheng Electronics Technology Co., Ltd
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RO4730G3 High frequency PCB
Introduction
Rogers RO4730G3 antenna grade laminates are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4730G3 dielectric materials provide the necessary mechanical and electrical properties for ideal antenna performance.
RO4730G3 antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4730G3 laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance.
Features
RO4730G3 features a dielectric constant of 3.0 with a tight tolerance of just ±0.05. This precise and consistent dielectric property ensures optimal signal integrity and predictable impedance control in your circuit designs.
Additionally, it delivers exceptional dissipation factors of just 0.0028, enabling efficient signal transmission and minimizing energy losses in the high-frequency designs.
RO4730G3 exhibits a remarkably low Z-axis coefficient of thermal expansion (CTE) at just 35.2 ppm/°C. This low CTE helps minimize the risk of delamination and improves the long-term reliability of your circuits, even under demanding thermal conditions.
Complementing its low CTE, RO4730G3 also boasts a low temperature coefficient of dielectric constant (TCDk) of just 34 ppm/°C. This exceptional thermal stability ensures your circuit's performance remains consistent, even as temperatures fluctuate.
Finally, RO4730G3 features an exceptionally high glass transition temperature (Tg) of greater than 280°C. This high Tg ensures the material can withstand the elevated temperatures encountered during manufacturing and operation, further enhancing the long-term reliability of the circuits.
PCB Capability (RO4730G3)
| PCB Material: | Hydrocarbon ceramic woven glass |
| Designator: | RO4730G3 |
| Dielectric constant: | 3.0 ±0.05 (process); 2.98 (design) |
| Layer count: | 1-layer, 2-layer, Multi-layer, Hybrid configuration |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness (LoPro Copper): | 5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm) |
| Laminate thickness (ED Copper) | 20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion silver, ENEPIG, Pure gold, OSP,etc. |
Our RO4730G3 PCBs are custom-made to meet a wide range of specifications to suit your project needs.
Choose from a variety of layer counts including single layer, double layer, multi-layer, and hybrid configurations. Copper weights available in 1oz (35µm) and 2oz (70µm).
The laminate thickness options include LoPro Copper at 5.7mil to 60.7mil and ED Copper at 20mil to 60mil, providing flexibility for diverse applications.
Maximum PCB size of 400mm X 500mm ensures compatibility with various designs. Customize your boards with solder mask colors such as green, black, blue, yellow, and red, among others.
Select from surface finishes like bare copper, HASL, ENIG, immersion tin, immersion silver, ENEPIG, pure gold, OSP, and more.
Applications
The RO4730G3 is typically for the applications of Cellular Base Station Antennas.
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