Shenzhen Bicheng Electronics Technology Co., Ltd
RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,
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6-Layer RO4003C/Tg170 FR-4 PCB: 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask
Overview of the 6-Layer RO4003C/Tg170 FR-4 PCB
The 6-Layer RO4003C/Tg170 FR-4 PCB is a highly durable and performance-optimized printed circuit board designed for demanding applications in cellular base stations, automotive radar, and RF systems. This PCB combines Rogers RO4003C and Tg170 FR-4 cores, offering exceptional thermal stability, low dielectric loss, and dimensional reliability. With 6.8mm finished thickness, immersion gold surface finish, and controlled-depth slots, the design ensures long-term reliability and optimal signal performance for high-frequency devices.
This multi-layer PCB is manufactured to IPC-Class-2 standards, ensuring consistent quality and worldwide availability. It's perfect for performance-sensitive, high-volume applications where precise electrical and thermal properties are critical.
PCB Construction Details
The 6-layer rigid PCB is built with a mix of RO4003C high-frequency laminate and Tg170 FR-4, providing a blend of high thermal conductivity and cost-effective manufacturability. Below is a detailed table of its construction specifications:
| Parameter | Specification |
| Base Material | RO4003C / Tg170 FR-4 |
| Layer Count | 6 Layers |
| Board Dimensions | 495mm x 345mm ± 0.15mm |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.8mm |
| Blind Vias | No |
| Finished Thickness | 6.8mm |
| Copper Weight | 1oz (1.4 mils) outer & inner layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Depth-Controlled Slots | Top and Bottom Layers |
| Electrical Testing | 100% tested prior to shipment |
PCB Stackup
The stackup for this 6-layer rigid PCB alternates between high-performance RO4003C and cost-efficient Tg170 FR-4, ensuring thermal stability and dielectric uniformity. The detailed layer structure is as follows:
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35 μm |
| Core Material | Tg170 FR-4 Core | 3.0mm |
| Copper Layer 2 | Copper (1oz) | 35 μm |
| Bonding Ply | Epoxy Resin (4mil) | 0.102mm |
| Copper Layer 3 | Copper (1oz) | 35 μm |
| Core Material | Rogers RO4003C Core | 0.305mm |
| Copper Layer 4 | Copper (1oz) | 35 μm |
| Bonding Ply | Epoxy Resin (4mil) | 0.102mm |
| Copper Layer 5 | Copper (1oz) | 35 μm |
| Core Material | Tg170 FR-4 Core | 3.0mm |
| Copper Layer 6 | Copper (1oz) | 35 μm |
PCB Statistics
The 6-layer RO4003C/Tg170 FR-4 PCB is optimized for high-density component placement and reliable signal routing. Below are its key statistics:
Introduction to RO4003C
The Rogers RO4003C laminate is a woven glass-reinforced hydrocarbon/ceramic material that offers the electrical performance of PTFE but with the manufacturability of epoxy-glass laminates. Its low dielectric constant (Dk) of 3.38 ± 0.05 and dissipation factor of 0.0027 at 10GHz make it ideal for high-frequency applications.
Key features of RO4003C include:
Applications
This PCB is ideal for applications requiring high-frequency stability and reliability, such as:
With its 6-layer construction, RO4003C core, and immersion gold finish, the 6-layer RO4003C/Tg170 FR-4 PCB is the perfect choice for demanding RF and microwave systems. Its combination of durability, performance, and cost-efficiency makes it a standout solution for high-volume, performance-critical applications.