Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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RO4003C 2-Layer PCB built on 16mil Core laminate with ENIG Finish apply for Cellular Base Station Antennas and Power Amplifiers

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Shenzhen Bicheng Electronics Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissSally Mao
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RO4003C 2-Layer PCB built on 16mil Core laminate with ENIG Finish apply for Cellular Base Station Antennas and Power Amplifiers

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Brand Name :Rogers
Model Number :RO4003C
Certification :ISO9001
Place of Origin :China
MOQ :1PCS
Price :0.99-99USD/PCS
Payment Terms :T/T, Paypal
Supply Ability :50000pcs
Delivery Time :2-10 working days
Packaging Details :Packing
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RO4003C PCB: 2-Layer, 16mil Core, ENIG Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


Overview of the 2-Layer RO4003C PCB
The 2-layer RO4003C PCB is a high-performance laminate designed for RF and microwave applications requiring low loss, tight dielectric constant (Dk) control, and cost-effective manufacturability. Built with Rogers RO4003C material, this PCB provides the electrical performance of PTFE-based laminates but with the processing ease of FR-4, eliminating the need for special handling and through-hole treatments.

With a 16mil (0.406mm) core, ENIG (Electroless Nickel Immersion Gold) surface finish, and black silkscreen, this PCB is engineered for high-frequency stability and long-term reliability, making it ideal for cellular base station antennas, automotive radar, and satellite communication systems.

RO4003C 2-Layer PCB built on 16mil Core laminate  with ENIG Finish apply for Cellular Base Station Antennas and Power Amplifiers

PCB Construction Details

ParameterSpecification
Base MaterialRogers RO4003C
Layer Count2 layers
Board Dimensions38.8mm x 52.4mm ± 0.15mm
Minimum Trace/Space5/5 mils
Minimum Hole Size0.2mm
Blind ViasNo
Finished Board Thickness0.5mm
Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishENIG (Electroless Nickel Immersion Gold)
Top SilkscreenBlack
Bottom SilkscreenNone
Top Solder MaskNone
Bottom Solder MaskNone
Electrical Testing100% tested prior to shipment



PCB Stackup
The RO4003C PCB stackup is optimized for dimensional stability and high-frequency performance. Below is the detailed stackup:

LayerMaterialThickness
Copper Layer 1Copper (1oz)35 μm
Core MaterialRogers RO4003C0.406mm (16mil)
Copper Layer 2Copper (1oz)35 μm




PCB Statistics
The 2-layer RO4003C PCB is designed for compact and high-performance layouts. Below are the key statistics:

  • Components: 6
  • Total Pads: 17
  • Thru Hole Pads: 11
  • Top SMT Pads: 6
  • Bottom SMT Pads: 0
  • Vias: 9
  • Nets: 2



Introduction to RO4003C Material
Rogers RO4003C laminates are woven glass-reinforced hydrocarbon/ceramic materials offering high-frequency performance similar to PTFE-based laminates but at a fraction of the cost. These materials are easy to process using standard FR-4 techniques, providing cost-effective solutions for high-volume and performance-sensitive applications.


Key advantages include:

  • Tight control on dielectric constant (Dk): Ensures consistent and stable performance across applications.
  • Low Z-axis CTE: Provides reliable plated through-hole (PTH) quality under thermal shock conditions.
  • Ease of Processing: Processes like FR-4 without the need for special handling.


Features of RO4003C

  • Dielectric Constant (Dk): 3.38 ± 0.05 at 10GHz
  • Dissipation Factor (Df): 0.0027 at 10GHz, 0.0021 at 2.5GHz
  • Thermal Coefficient of Dielectric Constant (TCDk): +40 ppm/°C
  • Thermal Conductivity: 0.71 W/m·K
  • Coefficient of Thermal Expansion (CTE): X-axis: 11 ppm/°C, Y-axis: 14 ppm/°C, Z-axis: 46 ppm/°C
  • Moisture Absorption: 0.06%
  • Glass Transition Temperature (Tg): >280°C




Benefits of RO4003C PCB

  1. High-Frequency Performance: Low dissipation factor ensures minimal signal loss.
  2. Ease of Processing: Processes like FR-4 for lower fabrication costs.
  3. Dimensional Stability: Excellent stability for multi-layer constructions and thermal cycling.
  4. Cost-Effective: Offers high performance at a fraction of the cost of PTFE laminates.
  5. Tight Dk Tolerance: Ensures consistent RF performance.
  6. Low Moisture Absorption: Maintains performance in humid environments.



Applications of RO4003C PCB

  • Cellular Base Station Antennas
  • Power Amplifiers
  • RF Identification (RFID) Tags
  • Automotive Radar and Sensors
  • Satellite Communication (LNB)



Why Choose the 2-Layer RO4003C PCB?
The 2-layer RO4003C PCB is a reliable and cost-effective solution for high-frequency circuit designs requiring low loss, thermal stability, and consistent dielectric properties. Its 16mil core, ENIG finish, and high thermal conductivity make it an excellent choice for RF, microwave, and automotive radar applications.

Contact us today to learn more about this high-performance PCB or to place your order!
RO4003C 2-Layer PCB built on 16mil Core laminate  with ENIG Finish apply for Cellular Base Station Antennas and Power Amplifiers

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