Shenzhen Bicheng Electronics Technology Co., Ltd
RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,
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Product Description: F4BTMS450 4-Layer PCB
This newly shipped 4-layer PCB, constructed with F4BTMS450 material, is a high-reliability solution designed for demanding RF, microwave, and aerospace applications. Engineered with precision and built to meet IPC-Class-2 standards, this PCB offers a balance of advanced material properties and robust construction features. Below, we analyze its advantages and disadvantages in detail.
PCB Construction Details
| Parameter | Specification |
| Base Material | F4BTMS450 |
| Layer Count | 4 layers |
| Board Dimensions | 20mm x 20mm (± 0.15mm) |
| Finished Thickness | 1.4mm |
| Copper Weight | 1oz (35μm) for all layers |
| Surface Finish | Immersion Gold |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Via Plating Thickness | 20μm |
| Solder Mask | None |
| Silkscreen | None |
| Electrical Testing | 100% tested before shipment |
Advantages
F4BTMS450 has a dissipation factor (Df) of 0.0015 at 10GHz, ensuring minimal signal loss, making it ideal for high-frequency applications such as radar, microwave circuits, and satellite communication systems.
The PCB offers a Dk of 4.5 ± 0.09 at 10GHz, ensuring consistent signal integrity across a wide frequency range. This stability is critical for RF and phased array antenna designs.
With a thermal conductivity of 0.64 W/mK and a low thermal coefficient of Dk (-58 ppm/°C), the PCB maintains electrical performance even under thermal stresses.
The CTE values (X/Y: 12 ppm/°C, Z: 45 ppm/°C) ensure excellent dimensional stability, reducing warping during thermal cycling and improving reliability in high-temperature aerospace environments.
A low moisture absorption rate of 0.08% protects the board from performance degradation in humid or moisture-prone environments.
Versatile Applications:
The F4BTMS450 PCB is specifically designed for high-performance and mission-critical applications such as:
Aerospace systems: Space equipment, cabin systems, and satellite communications.
Microwave and RF applications: Radar systems, feed networks, and phased array antennas.
Military-grade designs: High-frequency radar and secure communication systems.
Disadvantages
Limited Protective Layers
Complex Manufacturing Requirements
Small Component Count
Cost Considerations
Conclusion
The F4BTMS450 4-layer PCB is an exceptional choice for high-frequency, high-reliability applications, particularly in aerospace and RF/microwave systems. Its advanced material properties, such as low loss, thermal stability, and dimensional integrity, make it ideal for mission-critical designs requiring precision and durability. However, the lack of protective layers, coupled with higher manufacturing costs, may limit its use in more general-purpose or cost-sensitive applications.
This PCB stands out as a specialized solution for cutting-edge industries requiring high-performance materials and reliable performance in demanding environments. For RF engineers and system designers, the F4BTMS450 4-layer PCB is a dependable option for next-generation communication systems.