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RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Home / Products / Copper Clad Laminates / F4BTMS233 0.127mm 0.254mm 0.508mm double layer Copper-Clad Laminate Low-Loss Substrate for Aerospace and RF Applications /

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Shenzhen Bicheng Electronics Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissSally Mao
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F4BTMS233 0.127mm 0.254mm 0.508mm double layer Copper-Clad Laminate Low-Loss Substrate for Aerospace and RF Applications
F4BTMS233 0.127mm 0.254mm 0.508mm double layer Copper-Clad Laminate Low-Loss Substrate for Aerospace and RF Applications
  • F4BTMS233 0.127mm 0.254mm 0.508mm double layer Copper-Clad Laminate Low-Loss Substrate for Aerospace and RF Applications
  • F4BTMS233 0.127mm 0.254mm 0.508mm double layer Copper-Clad Laminate Low-Loss Substrate for Aerospace and RF Applications
  • F4BTMS233 0.127mm 0.254mm 0.508mm double layer Copper-Clad Laminate Low-Loss Substrate for Aerospace and RF Applications
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F4BTMS233 Copper-Clad Laminate: A High-Reliability, Low-Loss Substrate for Advanced Aerospace and RF Applications We are pleased to introduce the ...
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