Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Copper Clad Laminates

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Shenzhen Bicheng Electronics Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissSally Mao
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 Copper Clad Laminates

F4BTMS265 Double-sided Copper Clad Laminate with 1 oz RTF copper foil 0.127mm (5 mil), 0.254mm, 0.508mm, 1.016mm, 1.524mm

F4BTMS265 High-Reliability Copper Clad Laminate Description The F4BTMS265 is an advanced, aerospace-grade, ceramic-filled PTFE (Polytetrafluoroethylen...
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Wngling low DK 2.55 F4BTMS255 Copper Clad Laminate Aerospace-Grade High-Frequency Material

F4BTMS255 Copper Clad Laminate: Aerospace-Grade High-Frequency Material Taizhou Wangling Company presents the F4BTMS255, a premium PTFE-based laminate ...
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F4BTMS233 0.127mm 0.254mm 0.508mm double layer Copper-Clad Laminate Low-Loss Substrate for Aerospace and RF Applications

F4BTMS233 Copper-Clad Laminate: A High-Reliability, Low-Loss Substrate for Advanced Aerospace and RF Applications We are pleased to introduce the ...
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CuClad 250 Substarte Copper-Clad Laminate with 0.25mm 0.51mm 0.79mm 1.57mm for and RF Systems

CuClad® 250 Copper-Clad Laminate: The Isotropic, High-Stability Foundation for Advanced and RF Systems We are proud to introduce the CuClad® 250, a .....
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CuClad 217 both layer Copper Clad Laminate with 0.25mm, 0.51mm, 0.79mm, 1.57mm substrate for Demanding RF/Microwave Circuits

CuClad 217 Copper Clad Laminate: The Pinnacle of Low-Loss, Isotropic Performance for Demanding RF/Microwave Circuits As your dedicated supplier for .....
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CuClad 233 DK2.33 raw material double sided substarte Copper-Clad Laminate with with 1/2, 1 or 2 oz copper on both s ides

CuClad® 233 Copper-Clad Laminate: The Ideal Balance of Low Loss, Isotropy, and Processability We are pleased to present the CuClad® 233, a high...
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F4BTMS294 Double-sided copper clad laminate material substrate PCB built on 0.254mm, 0.508mm, 1.016mm

F4BTMS294 High-Reliability Copper Clad Laminate Description The F4BTMS294 is an ultra-stable, ceramic-reinforced PTFE (Polytetrafluoroethylene) ...
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Manufacture F4BTMS220 circuit boards use PTFE material High-Frequency Double sided copper laminate for RF Applications

F4BTMS220 Ultra-Low Loss PTFE Laminate: High-Frequency Performance for Demanding Aerospace & RF Applications As your specialized supplier of advanced ...
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F4BM275 RF substrate Double-sided copper clad laminate ED copper in weights of 0.5oz 18µm, 1oz 35µm 1.5oz 50µm, 2 oz 70µm

F4BM275: A High-Performance RF Laminate for Balanced Design Engineered as a pivotal member of the versatile F4BM/F4BME product family, the F4BM275 ...
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Low DK 2.55 AD255C PTFE Copper Clad Laminate: High-Performance Antenna Material for Wireless Applications

AD255C Copper Clad Laminate: High-Performance Antenna Material for Wireless Applications Rogers Corporation introduces the AD255C, a premium glass...
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