Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Copper Clad Laminates

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Shenzhen Bicheng Electronics Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissSally Mao
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1 - 10 of 31

 Copper Clad Laminates

F4BME217 material both laryer 1oz Copper Clad Laminate using in RF antenna microwave app

F4BME217 Ultra-Low Loss Copper Clad Laminate Description The F4BME217 is a premium, glass fiber-reinforced PTFE (Polytetrafluoroethylene) copper clad ...
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IsoClad 917 (εr=2.17) High-Frequency Laminate Double-sided copper cladding for RF Circuits

IsoClad 917 (εr=2.17) High-Frequency Laminate: Engineered for Conformal and Precision RF Circuits As your trusted supplier for advanced PCB materials, ...
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CuClad 217 both layer Copper Clad Laminate with 0.25mm, 0.51mm, 0.79mm, 1.57mm substrate for Demanding RF/Microwave Circuits

CuClad 217 Copper Clad Laminate: The Pinnacle of Low-Loss, Isotropic Performance for Demanding RF/Microwave Circuits As your dedicated supplier for .....
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F4BTMS294 Double-sided copper clad laminate material substrate PCB built on 0.254mm, 0.508mm, 1.016mm

F4BTMS294 High-Reliability Copper Clad Laminate Description The F4BTMS294 is an ultra-stable, ceramic-reinforced PTFE (Polytetrafluoroethylene) ...
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F4BME275 High-Frequency double sided Copper Clad Laminate | raw material | Substarte using for RF microwave PCB

F4BME275 High-Frequency Copper Clad Laminate Description The F4BME275 is a high-performance, glass fiber-reinforced PTFE (Polytetrafluoroethylene) ...
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F4BME294 High-Frequency double sided Copper Clad Laminate 0.5mm, 0.762mm, 1.0mm, 1.524mm substrate for RF microwave PCB

F4BME294 High-Performance Copper Clad Laminate Description The F4BME294 is an advanced, glass fiber-reinforced PTFE (Polytetrafluoroethylene) copper ....
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F4BTMS265 Double-sided Copper Clad Laminate with 1 oz RTF copper foil 0.127mm (5 mil), 0.254mm, 0.508mm, 1.016mm, 1.524mm

F4BTMS265 High-Reliability Copper Clad Laminate Description The F4BTMS265 is an advanced, aerospace-grade, ceramic-filled PTFE (Polytetrafluoroethylen...
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RT/duroid® 6202 Copper Clad Laminate Hoz (18 µm) and 1 oz (35 µm) built on 0.127mm 0.508mm 0.762mm

RT/duroid® 6202 Copper Clad Laminate: Engineered for Exceptional Electrical and Mechanical Stability RT/duroid® 6202 is a high-performance, ceramic......
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F4BM275 RF substrate Double-sided copper clad laminate ED copper in weights of 0.5oz 18µm, 1oz 35µm 1.5oz 50µm, 2 oz 70µm

F4BM275: A High-Performance RF Laminate for Balanced Design Engineered as a pivotal member of the versatile F4BM/F4BME product family, the F4BM275 ...
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F4BM265 Double-sided copper clad laminate DK 2.65 PTFE RF Circuit Board with 1oz Bare Copper

F4BM265 Copper Clad Laminate: A Tunable, High-Performance Substrate for Demanding RF Applications The F4BM265, part of the F4BM/F4BME series from ...
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